The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
Title
: 
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2006

Physical Description
: 
1 reel ; negatif ; 35 mm.

General Note
: 
5 titles on 1 microfilm

Subject Term
: 
Solder and soldering
 
Intermetallic compounds

Added Author
: 
Moey, Chin Boon

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010148009MFL 013767Non Circulating MicrofilmMicrofilm