Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM
Title
:
Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM
Publication Information
:
Skudai : Universiti Teknologi Malaysia, 2003
Physical Description
:
1 reel : negatif ; 35mm.
General Note
:
5 titles on 1 microfilm
Subject Term
:
Solder and soldering
Nickel-plating
Motor vehicles -- Dynamics -- Computer simulation
Motor vehicles -- Dynamics -- Simulation methods
Helmets
Safety hats
Trailers -- Design and construction
Horses -- Transportation -- Standards
Drag (Aerodynamics)
Automobiles -- Aerodynamics
Added Author
:
Phang, Chin Ewe
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
Library | Item Barcode | Call Number | Material Type | Item Category 1 |
---|
PSZ JB | 30000010086056 | MFL 12649 | Non Circulating Microfilm | Microfilm |