Analysis of a wire bonding machine's signature using autocorrelation
Title
:
Analysis of a wire bonding machine's signature using autocorrelation
Personal Author
:
Ahmad Zaki Shukor
Publication Information
:
Skudai : Universiti Teknologi Malaysia, 2001
Subject Term
:
Signal processing
Autocorrelation (Statistics)
Project Paper (Bachelor of Electrical Engineering (Mechatronic)) - Universiti Teknologi Malaysia, 2001
| Library | Item Barcode | Call Number | Material Type | Item Category 1 |
|---|
| Perpustakaan Raja Zarith Sofiah | 30000004792713 | TK5102.5 A92 2001 | Closed Access Thesis | UTM Project Paper (Closed Access) |