Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages
Title
: 
Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages

Personal Author
: 
Tan, Cheu Li

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2003

Subject Term
: 
Solder and soldering
 
Electronic packaging

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2003


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
Perpustakaan Raja Zarith Sofiah30000010027629TS196.4 T36 2003Closed Access ThesisUTM Project Paper (Closed Access)