Thermal simulation of finned metal foam heat sink for electronic cooling application
Title
: 
Thermal simulation of finned metal foam heat sink for electronic cooling application

Personal Author
: 
Haslina Abdullah

Publication Information
: 
2008

Physical Description
: 
xiv, 65 p. : ill. ; 30 cm.

General Note
: 
Supervisor : Dr. Nazri Kamsah
 
Also available in CD-ROM : CP 027035 ra

Subject Term
: 
Electronic packaging
 
Heat sinks (Electronics)

Added Author
: 
Nazri Kamsah

Added Corporate Author
: 
Fakulti Kejuruteraan Mekanikal

Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2008


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
FKM LibraryFKM30000005253TK7870.15 H37 2008 rafClosed Access ThesisUTM Project Paper (Closed Access)
Perpustakaan Raja Zarith Sofiah30000010211680TK7870.15 H37 2008 rafClosed Access ThesisUTM Project Paper (Closed Access)