Quality improvement of solder paste printing process using six sigma methodology
Title
: 
Quality improvement of solder paste printing process using six sigma methodology

Personal Author
: 
Wong, Jing Hao

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2005

Physical Description
: 
1v + 1 CD-ROM

General Note
: 
Also available in compact disc version : CP 4493 ra

Subject Term
: 
Production management -- Quality control
 
Process control
 
Solder pastes
 
Surface mount technology

Electronic Access
: 
Full text

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
Perpustakaan Raja Zarith Sofiah30000010094793TS156 W664 2005Closed Access ThesisUTM Project Paper (Closed Access)