Electronics packaging forum
Title
: 
Electronics packaging forum

Publication Information
: 
New York : Van Nostrand Reinhold,

Physical Description
: 
2v.

ISBN
: 
9780442001780
 
9780442004767

General Note
: 
Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.

Subject Term
: 
Electronic packaging -- Congresses

Added Author
: 
Morris, James E., 1944-

Added Corporate Author
: 
State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ KL30000001140957TK7870.15E53 1990Open Access BookBook
PSZ KL30000001140916TK7870.15E53 1990Open Access BookBook