Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition
Title
Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition

Personal Author
Chai, Ai Bao

Publication Information
Skudai : Universiti Teknologi Malaysia, 2007

Physical Description
1 CD-ROM ; 12 cm.

General Note
Also available in printed version : TS175.5 C43 2007 raf

Subject Term
Commercial products -- Testing
 
Electronic packaging
 
Mechanical engineering

Added Corporate Author
Fakulti Kejuruteraan Mekanikal

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2007


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010176591CP 020214 raUTM Special Collection - Computer FileCompact Disc Accompanies UTM Thesis/Project Paper