Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
Title
: 
Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method

Personal Author
: 
Pang, Hooi San

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2007

Physical Description
: 
1 CD-ROM ; 12 cm.

General Note
: 
Also available in printed version : QD515 P36 2007 raf
 
Supervisor : Mohd. Nasir Tamin

Subject Term
: 
Thermal analysis
 
Expansion (Heat)

Added Corporate Author
: 
Fakulti Kejuruteraan Mekanikal

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010187732CP 021788 raUTM Special Collection - Computer FileCompact Disc Accompanies UTM Thesis/Project Paper