Classical and damage mechanics-based models for lead-free solder interconnects
Title
: 
Classical and damage mechanics-based models for lead-free solder interconnects

Personal Author
: 
Lai, Zheng Bo, 1984-

Publication Information
: 
2009

Physical Description
: 
1 CD-ROM ; 12 cm.

General Note
: 
Also available in printed version : TK7870.15 L344 2009 raf
 
Supervisors : Prof. Dr Mohd. Nasir Tamin and Dr Nazri Kamsah

Subject Term
: 
Electronic apparatus and appliances -- Reliability
 
Solder and soldering
 
Joints (Engineering) -- Reliability

Added Corporate Author
: 
Fakulti Kejuruteraan Mekanikal

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010223484CP 017372 raUTM Special Collection - Computer FileCompact Disc Accompanies UTM Thesis/Project Paper