Ball attach yield improvement-DMAIC approach
Title
: 
Ball attach yield improvement-DMAIC approach

Personal Author
: 
Mutukumaar Nallappan, 1984-

Publication Information
: 
2011

Physical Description
: 
xii, 55 p. : ill. ; 30 cm.

General Note
: 
Also available in CD-ROM : CP 023990 ra
 
Supervisor : Dr. Wong Kuan Yew

Subject Term
: 
Solder and soldering
 
Welded joints

Added Author
: 
Wong, Kuan Yew, supervisor

Added Corporate Author
: 
Fakulti Kejuruteraan Mekanikal

Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2011


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
FKM LibraryFKM30000007165TJ243 B35 2011 rafClosed Access ThesisUTM Master Thesis (Closed Access)
Perpustakaan Raja Zarith Sofiah30000010248930TJ243 B35 2011 rafClosed Access ThesisUTM Master Thesis (Closed Access)