Adhesion of 6mm coated aggregate for chip seal application
Title
: 
Adhesion of 6mm coated aggregate for chip seal application

Personal Author
: 
Murni Mahadi, 1988-, author

Publication Information
: 
2011

Physical Description
: 
xiv, 60 p. : ill. ; 30 cm.

General Note
: 
Supervisor : Dr. Haryati Yaacob
 
Fulltext is available at http://dms.library.utm.my:8080
 
Also available in CD-ROM : CP 051983 ra

Subject Term
: 
Adhesion

Added Author
: 
Haryati Yaacob,

Added Corporate Author
: 
Fakulti Kejuruteraan Awam

Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
FKA LibraryFKA30000007130XX(767293.1)Reference BookUTM Project Paper (Open Shelves)
Perpustakaan Raja Zarith Sofiah30000010261051QC183 M87 2011 rafClosed Access ThesisUTM Project Paper (Closed Access)