Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics
Title
Effects of chemical mechanical polishing (CMP) parameters on NIP/AL substrate surface characteristics

Personal Author
Mohd. Aidil Rosli, 1985-

Publication Information
2014

Physical Description
xi, 74 p. : ill. (some col.) ; 30 cm.

General Note
Supervisor : Prof. Dr. Noordin Mohd Yusof
 
Also available in CD-ROM : CP 032785 ra

Subject Term
Grinding and polishing
 
Chemical mechanical planarization

Added Author
Noordin Mohd. Yusof,

Added Corporate Author
Fakulti Kejuruteraan Mekanikal

Thesis (Sarjana Kejuruteraan (Kejuruteraan Industri)) - Universiti Teknologi Malaysia, 2014


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
FKM Library32000000000914TJ1280 M645 2014 rafClosed Access ThesisUTM Master Thesis (Closed Access)
Perpustakaan Raja Zarith Sofiah30000010327517TJ1280 M645 2014 rafClosed Access ThesisUTM Master Thesis (Closed Access)