Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM
Title
: 
Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2003

Physical Description
: 
1 reel : negatif ; 35mm.

General Note
: 
5 titles on 1 microfilm

Subject Term
: 
Solder and soldering
 
Nickel-plating
 
Motor vehicles -- Dynamics -- Computer simulation
 
Motor vehicles -- Dynamics -- Simulation methods
 
Helmets
 
Safety hats
 
Trailers -- Design and construction
 
Horses -- Transportation -- Standards
 
Drag (Aerodynamics)
 
Automobiles -- Aerodynamics

Added Author
: 
Phang, Chin Ewe

Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010086056MFL 12649Non Circulating MicrofilmMicrofilm