Experimental simulation of thermal conduction in an electronic component
Title
: 
Experimental simulation of thermal conduction in an electronic component

Personal Author
: 
Pui, Hon Hwa

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2000

Physical Description
: 
1 reel : negative ; 35mm.

General Note
: 
5 titles on 1 microfilm

Subject Term
: 
Thermal analysis -- Equipment and supplies
 
Electronic components -- Standards
 
Jigs and fixtures
 
Diesel motor -- Fuel systems -- Testing
 
Molding materials
 
Molding (Founding) -- Simulation methods
 
Combustion engineering
 
Combustion engineering -- Design

Added Author
: 
Md. Nor Anuar Mohamad

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010033981MFL 10557Non Circulating MicrofilmMicrofilm