Simulation of thermal strains development in microelctronics package
Title
: 
Simulation of thermal strains development in microelctronics package

Personal Author
: 
Nurul Nadiah Mohd. Top, 1986-

Publication Information
: 
2009

Physical Description
: 
xvi, 83 p. : ill. ; 30 cm.

General Note
: 
Supervisors : Dr. Nazri Kamsah
 
Also available in CD-ROM : CP 029110 ra

Subject Term
: 
Thermal stresses
 
Strains and stresses

Added Author
: 
Nazri Kamsah

Added Corporate Author
: 
Fakulti Kejuruteraan Mekanikal

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009


LibraryItem Barcode[[missing key: search.ChildField.CALLNUMBER]]Material TypeItem Category 1
FKM LibraryFKM30000006494Closed Access ThesisUTM Project Paper (Closed Access)
Perpustakaan Raja Zarith Sofiah30000010227535TA418.58 N87 2009 rafClosed Access ThesisUTM Project Paper (Closed Access)