Quality improvement of solder paste printing process using six sigma methodology
Title
: 
Quality improvement of solder paste printing process using six sigma methodology

Personal Author
: 
Wong, Jing Hao

Publication Information
: 
Skudai : Universiti Teknologi Malaysia, 2005

Physical Description
: 
1 CD-ROM ; 12 cm.

General Note
: 
Also available in printed version : TS156 W664 2005

Subject Term
: 
Production management -- Quality control
 
Process control
 
Solder pastes
 
Surface mount technology

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005


LibraryItem BarcodeCall NumberMaterial TypeItem Category 1
PSZ JB30000010094791CP 4493UTM Special Collection - Computer FileCompact Disc Accompanies UTM Thesis/Project Paper