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Application of six sigma methodology in reducing solder paste wastage

Title

Application of six sigma methodology in reducing solder paste wastage

Personal Author

Tan, Seong Fong, 1980-

Publication Information

2009

Physical Description

xxi, 98 p. : ill. ; 30 cm.

General Note

Supervisor : Prof. Dr. Noordin Mohd. Yusof

Also available in CD-ROM :

Added Author

Noordin Mohd. Yusof,

Added Corporate Author

Fakulti Kejuruteraan Mekanikal

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009

Library	Item Barcode	Call Number	Material Type	Item Category 1
FKM Library	FKM30000004243	XX(797275.1)	Closed Access Thesis	UTM Project Paper (Open Shelves)