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3. 
Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
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Cover image for Simulation and verification of electronic and biological systems
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Cover image for Design, automation, and test in Europe : the most influential papers of 10 years DATE
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Cover image for Analog circuit design : sensor and actuator interface electronics, integrated high-voltage electronics and power management, low power and high resolution ADC's
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Cover image for Analog circuit design : fractional-N synthesizers, design for robustness, line and bus drivers
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