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1. 
Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
2. 
Cover image for Three-dimensional molded interconnect devices (3D-MID)
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Cover image for Fundamentals of reliability engineering : applications in multistage interconnection networks
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Cover image for High-speed photonics interconnects
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Cover image for High-performance integrated circuit design
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Cover image for Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A.
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Cover image for Reliability of RoHS-Compliant 2D and 3D IC interconnects
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Cover image for Recent advances in dielectric materials
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Cover image for Integrated interconnect technologies for 3D nanoelectronic systems
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Cover image for On-chip communication architectures : system on chip interconnect
11. 
Cover image for Optimization of routing algorithm for interconnect delay in ultra large scale interation designs
12. 
Cover image for Interconnect delay and routing in nanometer VLSI
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