Search Results for Intermetallic compounds

94 Results Found

1 2 3 4 5 .. 8

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Intermetallic compounds (IMC) formation during soldering

Zureena Abu Samah, 1985-

Author

Zureena Abu Samah, 1985-

Format:

Call Number

CP 026988 ra

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Intermetallic compounds (IMC) formation during soldering

Zureena Abu Samah, 1985-

Author

Zureena Abu Samah, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Format:

Call Number

TS610 Z87 2008 raf

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Intermetallic compounds : principles and practice

Westbrook, Jack Hall, 1924-

Author

Westbrook, Jack Hall, 1924-, Fleischer, R. L. (Robert Louis), 1930-

Format:

Call Number

TA483 I57 1995

Publisher

John Wiley & Sons,

Publication Date

1995

ISBN

9780471942191 9780471934547

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Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish

Noor Afzan Muhamad, 1985-

Author

Noor Afzan Muhamad, 1985-

Format:

Call Number

CP 026989 ra

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Effect of surface finish metallurgy on intermetallic compounds during soldering with tin - silver - copper solders

Ali Ourdjini, author

Author

Ali Ourdjini, author, Azmah Hanim, author, Siti Rabiatull Aisha, author, Y. T. Ching, author, International Electronics Manufacturing Technology Conference (33rd : 2008 : Pulau Pinang)

Format:

Call Number

Publisher

Universiti Teknologi Malaysia,

Publication Date

2008

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Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish

Noor Afzan Muhamad, 1985-

Author

Noor Afzan Muhamad, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Format:

Call Number

TN690 N66 2008 raf

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint

Tan, Kok Hoong

Author

Tan, Kok Hoong

Format:

Call Number

CP 12540

Publisher

Universiti Teknologi Malaysia,

Publication Date

2006

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

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Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint

Tan, Kok Hoong

Author

Tan, Kok Hoong

Format:

Call Number

TS226 T36 2006

Publisher

Universiti Teknologi Malaysia,

Publication Date

2006

Full text

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

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Cover image for Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy

Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy

Kee, Hang Ching

Author

Kee, Hang Ching

Format:

Call Number

TA489 K43 2003

Publisher

Universiti Teknologi Malaysia,

Publication Date

2003

Project Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003

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10.

Intermetallic compounds : principles and practise : v.3 progress

Westbrook, Jack Hall, 1924-

Author

Westbrook, Jack Hall, 1924-, Fleischer, R. L. (Robert Louis), 1930-

Format:

Call Number

TA483 I57 2003

Publisher

John Wiley & Sons,

Publication Date

2003 2002

ISBN

9780471493150

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11.

Recovery and accumulation of high-purity hydrogen with the use of hydride-forming intermetallic compounds

Tarasov, B. P.

Author

Tarasov, B. P., Shilkin, S. P.

Format:

Call Number

MAK 17700

Publication Date

1995

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12.

Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan)

Author

Electronic Packaging Interconnect Technology Symposium (2017 : Fukuoka-ken, Japan), Nogita, Kauhiro, editor, Mohd. Arif Anuar Mohd. Salleh, editor, Mohd. Mustafa Al Bakri Abdullah, editor, Liyana Jamaludin, editor

Format:

Call Number

TK7870.15 E443 2018

Publication Date

2018

ISBN

9783035713244

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