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2. 
Cover image for Reliability and materials issues of III-V and II-VI semiconductor optical and electrical devices and materials II : symposium held April 9-13, 2012, San Francisco, California, U.S.A.
3. 
Cover image for Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A.
4. 
Cover image for Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010
5. 
Cover image for Silicon science and advanced micro-device engineering I : selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
6. 
Cover image for Sensors and microsystems : proceedings of the 13th Italian conference Roma, Italy, 19-21 February 2008
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Cover image for Materials for information technology : devices, interconnects and packaging
12. 
Cover image for Sensors and microsystems :  proceedings of the 3rd Italian Conference, Genova, Italy 11-13 February 1998
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