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Microelectronic packaging
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Multichip modules (Microelectronics) -- Design and construction
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Cover image for Microelectronic packaging
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Cover image for Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination
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Cover image for Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination
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Cover image for Cooling of microelectronic and nanoelectronic equipment : advances and emerging research
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Cover image for Microwave and millimeter-wave electronic packaging
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Cover image for Adhesion in microelectronics
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Cover image for MEMS : fundamental technology and applications
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Cover image for LCP for microwave packages and modules
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Cover image for Semiconductor packaging : materials interaction and reliability
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Cover image for Introduction to microsystem packaging technology
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Cover image for Advanced materials for thermal management of electronic packaging
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Cover image for Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010
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