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1. 
Cover image for Tight binding model of lightly doped drain and source graphene nanoribbon
2. 
Cover image for Tight binding model of lightly doped drain and source graphene nanoribbon
3. 
Cover image for Wire bonding in microelectronics
4. 
Cover image for Wire bonding in microelectronics
5. 
Cover image for Introduction to the physics and chemistry of materials
6. 
Cover image for Wafer bonding : applications and technology
7. 
Cover image for Application of signal analysis techniques for condition monitoring of a wire-bonding machine
8. 
Cover image for Kerja berkumpulan di syarikat elektronik : kajian kes di NEC Semiconductor (M), Telok Panglima Garang, Banting, Selangor Darul Ehsan
9. 
Cover image for Digital povic meter for auto wire bonder
10. 
Cover image for Balanced amplifier design ; Comparative study of A.C. drives ; Derivation of three phase thryister pulses with digital delay angle display from single phase circuits ; Digital povic motor for auto wire border ; Macromodelling of analog integrated circuit fet operational amplifier