Electronic packaging and interconnection handbook

Title:

Edition:

3rd ed.

Publication Information:

New York : McGraw-Hill, 2000

ISBN:

9780071347457

Subject Term:

Electronic packaging -- Handbooks, manuals, etc.

Added Author:

Harper, Charles A.

Available:*

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000004759308	TK7870.15 H37 2000	Open Access Book	Book	Searching... Unknown

On Order

Preface	p. xi
Electronic Packaging Defined	p. xiii
Contributors	p. xiv
Part 1 Fundamental Technologies
Chapter 1. Materials for Electronic Packaging
Polymers for Electronic Packaging
1.1 Introduction	p. 1.1
1.2 Future Electronic Packaging System Needs	p. 1.2
1.3 Recent Advancements in Polymeric Materials for Electronic Packaging	p. 1.2
1.4 Polymeric Materials For Microelectronics	p. 1.3
1.5 Conclusions and Future Developments	p. 1.15
Bibliography	p. 1.15
Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics
1.6 Basics	p. 1.22
1.7 Under-Bump Metallization	p. 1.24
1.8 Bumping Materials	p. 1.27
1.9 Bumping Processes	p. 1.30
1.10 Joining Materials and Agents	p. 1.34
1.11 The Assembly Process	p. 1.38
1.12 Encapsulation/Underfill	p. 1.41
1.13 Substrates for Flip Chips	p. 1.46
1.14 Features and Benefits	p. 1.48
1.15 Limitations and Issues	p. 1.49
1.16 Performance and Reliability	p. 1.51
1.17 Applications	p. 1.51
1.18 Summary and Conclusions	p. 1.53
References	p. 1.54
Ceramic Materials
1.19 Introduction	p. 1.58
1.20 Classes of Materials Covered	p. 1.65
1.21 Summary--Ceramics	p. 1.93
References	p. 1.93
Chapter 2. Thermal Management
2.1 Introduction	p. 2.1
2.2 Why Thermal Management?	p. 2.2
2.3 Heat Flow Theory	p. 2.5
2.4 The Thermal Design	p. 2.35
2.5 Heat Sinks	p. 2.36
2.6 Circuit Card Assembly Cooling	p. 2.50
2.7 High heat-load cooling	p. 2.57
2.8 Special cooling devices	p. 2.66
2.9 Computer-Based Thermal Analysis	p. 2.75
2.10 Thermal Measurements	p. 2.79
References	p. 2.90
Chapter 3. Thermal and Mechanical Stress Behavior in Electronic Packaging
3.1 Introduction	p. 3.1
3.2 Stress Generation and Fatigue	p. 3.2
3.3 Stress Environments	p. 3.5
3.4 Material Mechanical Properties	p. 3.8
3.5 Soft Solder Fatigue	p. 3.12
3.6 Mechanical and Thermomechanical Models	p. 3.13
3.7 Modified Coffin-Manson Equations	p. 3.18
3.8 Miner's Rule	p. 3.20
3.9 FEM Package Representation	p. 3.22
3.10 Thermal Analysis Using FEM	p. 3.24
3.11 Total Inelastic Strain Energy	p. 3.25
3.12 Crack Growth Theory	p. 3.25
3.13 Temperature Dependence of Properties	p. 3.27
3.14 Packaging Fatigue	p. 3.28
3.15 Die Cracking and Delamination	p. 3.28
3.16 Flip Chips	p. 3.31
3.17 Ball Grid Arrays	p. 3.36
3.18 Chip on Board	p. 3.37
3.19 Level-Two Packaging--Pin-in-Hole	p. 3.39
3.20 Leadless and Leaded Quad Packages	p. 3.40
3.21 FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints	p. 3.42
3.22 Leaded Chip Carriers (Quad Flat Packages)	p. 3.45
3.23 Summary	p. 3.46
References	p. 3.47
Chapter 4. Connector and Interconnection Technology
4.1 Connector Overview	p. 4.1
4.2 The Contact Interface	p. 4.6
4.3 The Contact Finish	p. 4.10
4.4 Contact Springs	p. 4.17
4.5 Connector Housings	p. 4.21
4.6 Separable Connections	p. 4.27
4.7 Permanent Connections	p. 4.33
4.8 Connector Applications	p. 4.49
4.9 Connector Types	p. 4.55
4.10 Connector Testing	p. 4.72
References	p. 4.80
Chapter 5. Wiring and Cabling
5.1 Introduction	p. 5.1
5.2 Cabling Types	p. 5.2
5.3 Basic Construction	p. 5.4
5.4 Connector Characteristics	p. 5.45
5.5 Electromagnetic Interference and Shielding	p. 5.47
References	p. 5.55
Chapter 6. Solder Technologies for Electronic Packaging and Assembly
6.1 Introduction	p. 6.1
6.2 Solder Materials	p. 6.6
6.3 Solder Paste	p. 6.23
6.4 Soldering Methodology	p. 6.31
6.5 Solderability	p. 6.50
6.6 Cleaning	p. 6.52
6.7 Fine-Pitch Application	p. 6.53
6.8 Soldering-Related Issues	p. 6.57
6.9 Solder-Joint Appearance and Microstructure	p. 6.66
6.10 Solder-Joint Integrity	p. 6.71
6.11 Lead-Free Solders	p. 6.78
References	p. 6.82
Part 2 Interconnection Technologies
Chapter 7. Packaging and Interconnection of Integrated Circuits
7.1 Introduction	p. 7.1
7.2 Conventional Package Technologies	p. 7.20
7.3 Advanced Package Technologies	p. 7.45
7.4 Comparison of Technologies	p. 7.59
7.5 Package Families	p. 7.61
7.6 Package Design Considerations	p. 7.67
7.7 Package IC Assembly Processes	p. 7.77
7.8 Outsourcing--Subcontract Assembly	p. 7.91
7.9 Package to Second-Level Interconnection	p. 7.94
7.10 Summary and Future Trends	p. 7.95
References	p. 7.97
Chapter 8. Surface Mount Technologies
8.1 Introduction	p. 8.1
8.2 The Challenges of SMT	p. 8.2
8.3 Engineering Skills	p. 8.8
8.4 Electronics Packaging Families	p. 8.12
8.5 SMT Design for Manufacture	p. 8.26
8.6 Materials Impact on Process	p. 8.34
8.7 Process Guidelines for SMT Manufacturing	p. 8.41
8.8 Inspection and Quality Assurance	p. 8.72
8.9 Reliability	p. 8.78
References	p. 8.87
Chapter 9. The Hybrid Microelectronics and Multichip Module Technologies
9.1 Introduction	p. 9.1
9.2 Ceramic Substrates for Microelectronic Applications	p. 9.2
9.3 Composite Materials	p. 9.9
9.4 Thick Film Technology	p. 9.11
9.5 Cermet Thick Film Conductor Materials	p. 9.18
9.6 Thick Film Resistor Materials	p. 9.20
9.7 Thick Film Dielectric Materials	p. 9.28
9.8 Overglaze Materials	p. 9.29
9.9 Conclusions	p. 9.30
9.10 Thin Film Technology	p. 9.30
9.11 Thin Film Materials	p. 9.35
9.12 Comparison of Thick and Thin Film	p. 9.37
9.13 Copper Metallization Technologies	p. 9.37
9.14 Summary of Substrate Metallization Technologies	p. 9.46
9.15 Resistor Trimming	p. 9.46
9.16 Assembly of Hybrid Circuits	p. 9.51
9.17 Packaging	p. 9.62
9.18 Design of Hybrid Circuits	p. 9.68
9.19 Multichip Modules	p. 9.71
References	p. 9.75
Chapter 10. Chip Scale Packaging and Direct Chip Attach Technologies
10.1 Introduction	p. 10.1
10.2 Background and History	p. 10.2
10.3 Electronic Interconnection Regime	p. 10.5
10.4 Early Minimalist IC Packaging Solution	p. 10.6
10.5 Current Interconnection Trends	p. 10.7
10.6 Important Shared Issues	p. 10.7
10.7 Markets for CSP and DCA	p. 10.15
10.8 Direct Chip Attach Technologies	p. 10.19
10.9 Chip scale Packages	p. 10.26
10.10 Testing CSPs and Direct Attach Assemblies	p. 10.48
10.11 Summary	p. 10.58
References	p. 10.58
Chapter 11. Rigid and Flexible Printed Wiring Boards and Microvia Technology
11.1 Introduction	p. 11.1
11.2 Printed Circuit Board System Types	p. 11.2
11.3 Printed Circuit Board Materials	p. 11.6
11.4 Design Considerations	p. 11.19
11.5 Manufacturing Considerations	p. 11.54
11.6 Microvias	p. 11.65
11.7 Industry Standards	p. 11.84
Suggested Reading	p. 11.86
Acknowledgment	p. 11.88
Part 3 System Packaging Technologies
Chapter 12. Packaging of High-Speed and Microwave Electronic Systems
12.1 Introduction	p. 12.1
12.2 Types of Circuit Media for Modern Microwave Packaging	p. 12.4
12.3 Limitations of Microwave Integrated Circuits	p. 12.9
12.4 Technology of Microwave Integrated Circuits	p. 12.13
12.5 Planar Waveguides	p. 12.21
12.6 Lumped-Element Circuits for Microwave Packages	p. 12.29
12.7 High-Speed Digital Packaging	p. 12.34
12.8 Electrical Design Inputs	p. 12.37
12.9 Netlist Analysis	p. 12.40
12.10 Design Restrictions	p. 12.42
12.11 PWB Layout Considerations	p. 12.52
12.12 Preferred Redesign Options	p. 12.54
12.13 CAD Interface	p. 12.57
References	p. 12.59
Chapter 13. Packaging of High-Voltage Systems
13.1 Introduction	p. 13.1
13.2 Properties of Insulating Materials	p. 13.1
13.3 Field Stress and Configurations	p. 13.21
13.4 Aerospace Design Considerations	p. 13.29
13.5 Design and Manufacturing Guidelines	p. 13.37
13.6 Tests	p. 13.48
13.7 Problems and Suggested Solutions	p. 13.53
13.8 Conclusions	p. 13.54
References	p. 13.55
Chapter 14. Electrical Characterization and Modeling of IC Packaging
14.1 Introduction	p. 14.1
14.2 Package Electrical Analysis	p. 14.2
14.3 Package Modeling	p. 14.23
14.4 Package Modeling Program	p. 14.34
14.5 Verification Method for Modeling Programs	p. 14.41
14.6 Summary	p. 14.52
References	p. 14.53
Appendix Electronic Packaging Terms and Abbreviations	p. 1
Index	p. 1
About the Editor	p. 1

Available:*

On Order

Table of Contents