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Cover image for Hybrid microcircuit technology handbook :  materials, processes, design, testing and production
Hybrid microcircuit technology handbook : materials, processes, design, testing and production
Personal Author:
2nd ed.
Publication Information:
Westwood, N. J. : Noyes Publications, 1998
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30000004381384 TK7874 L45 1998 Open Access Book Book

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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Author Notes

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes.

Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont's Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello "The Discovery ad Development of Onium Salt Cationic Photoinitiators," J. Polymer Chemistry (1999)

Table of Contents

1 Introduction
2 Substrates
3 Thin Film Processes
Deposition Processes
Thin Film Resistor Processes
Photoresist Materials and Processes
Etching Materials and Processes
4 Thick Film Processes
Fabrication Processes
Direct Writing
Paste Materials
Non-Noble-Metal Thick Films
Polymer Thick Films
5 Resistor Trimming
6 Parts Selection
7 Assembly Processes
Die and Substrate Attachment
Particle Immobilizing Coatings
Vacuum-Baking and Sealing
8 Testing
9 Handling and Clean Rooms
Handling of Hybrid Circuits
Electrostatic Discharge
10 Design Guidelines
11 Documentation and Specifications
12 Failure Analysis
13 Multichip Modules
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