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Title:
Novel grinding process for failure analysis of IC Chip packaging
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2003
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010011226 | TJ1280 T36 2003 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |