Title:
Binderless grinding wheel for failure analysis of silicon die on I. C chips
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2003
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering(Manufacturing) - Universiti Teknologi Malaysia, 2003
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010014906 | TS695.5 W66 2003 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
