Lumped elements for RF and microwave circuits

Title:

Personal Author:

Bahl, I. J.

Series:

Artech House microwave library

Publication Information:

Norwood, MA : Artech House, 2003

ISBN:

9781580533096

Subject Term:

Lumped elements (Electronics)

Microwave integrated circuits

Radio frequency integrated circuits

Passive components

Available:*

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000003589524	TK7874.54 B33 2003	Open Access Book	Book	Searching... Unknown

Due to the unprecedented growth in wireless applications, development of low-cost solutions for RF and microwave communication systems has become of great importance. This is a comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The work offers an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges and crossovers. Supported with over 220 equations and more than 200 illustrations, it covers the practical aspects of each element in detail. From materials, fabrication and analyses to design, modelling and physical, electrical and thermal applications, this resource offers coverage of the critical topics for work in the field.

Author Notes

Inder Bahl is a Distinguished Fellow of Technology at M/A-COM, Roanoke, Virginia. He earned his Ph.D. in microwave engineering from the Indian Institute of Technology

Preface	p. xvii
Acknowledgments	p. xix
1 Introduction	p. 1
1.1 History of Lumped Elements	p. 1
1.2 Why Use Lumped Elements for RF and Microwave Circuits?	p. 2
1.3 L, C, R Circuit Elements	p. 4
1.4 Basic Design of Lumped Elements	p. 6
1.4.1 Capacitor	p. 7
1.4.2 Inductor	p. 8
1.4.3 Resistor	p. 8
1.5 Lumped-Element Modeling	p. 9
1.6 Fabrication	p. 11
1.7 Applications	p. 12
References	p. 13
2 Inductors	p. 17
2.1 Introduction	p. 17
2.2 Basic Definitions	p. 18
2.2.1 Inductance	p. 18
2.2.2 Magnetic Energy	p. 18
2.2.3 Mutual Inductance	p. 20
2.2.4 Effective Inductance	p. 20
2.2.5 Impedance	p. 21
2.2.6 Time Constant	p. 21
2.2.7 Quality Factor	p. 22
2.2.8 Self-Resonant Frequency	p. 23
2.2.9 Maximum Current Rating	p. 23
2.2.10 Maximum Power Rating	p. 23
2.2.11 Other Parameters	p. 23
2.3 Inductor Configurations	p. 24
2.4 Inductor Models	p. 25
2.4.1 Analytical Models	p. 25
2.4.2 Coupled-Line Approach	p. 28
2.4.3 Mutual Inductance Approach	p. 34
2.4.4 Numerical Approach	p. 36
2.4.5 Measurement-Based Model	p. 38
2.5 Coupling Between Inductors	p. 45
2.5.1 Low-Resistivity Substrates	p. 45
2.5.2 High-Resistivity Substrates	p. 46
2.6 Electrical Representations	p. 50
2.6.1 Series and Parallel Representations	p. 50
2.6.2 Network Representations	p. 51
References	p. 52
3 Printed Inductors	p. 57
3.1 Inductors on Si Substrate	p. 58
3.1.1 Conductor Loss	p. 60
3.1.2 Substrate Loss	p. 63
3.1.3 Layout Considerations	p. 64
3.1.4 Inductor Model	p. 65
3.1.5 Q-Enhancement Techniques	p. 69
3.1.6 Stacked-Coil Inductor	p. 80
3.1.7 Temperature Dependence	p. 84
3.2 Inductors on GaAs Substrate	p. 86
3.2.1 Inductor Models	p. 87
3.2.2 Figure of Merit	p. 88
3.2.3 Comprehensive Inductor Data	p. 88
3.2.4 Q-Enhancement Techniques	p. 104
3.2.5 Compact Inductors	p. 112
3.2.6 High Current Handling Capability Inductors	p. 116
3.3 Printed Circuit Board Inductors	p. 118
3.4 Hybrid Integrated Circuit Inductors	p. 121
3.4.1 Thin-Film Inductors	p. 121
3.4.2 Thick-Film Inductors	p. 124
3.4.3 LTCC Inductors	p. 126
3.5 Ferromagnetic Inductors	p. 127
References	p. 129
4 Wire Inductors	p. 137
4.1 Wire-Wound Inductors	p. 137
4.1.1 Analytical Expressions	p. 137
4.1.2 Compact High-Frequency Inductors	p. 144
4.2 Bond Wire Inductor	p. 146
4.2.1 Single and Multiple Wires	p. 147
4.2.2 Wire Near a Corner	p. 150
4.2.3 Wire on a Substrate Backed by a Ground Plane	p. 151
4.2.4 Wire Above a Substrate Backed by a Ground Plane	p. 153
4.2.5 Curved Wire Connecting Substrates	p. 154
4.2.6 Twisted Wire	p. 155
4.2.7 Maximum Current Handling of Wires	p. 155
4.3 Wire Models	p. 156
4.3.1 Numerical Methods for Bond Wires	p. 156
4.3.2 Measurement-Based Model for Air Core Inductors	p. 156
4.3.3 Measurement-Based Model for Bond Wires	p. 158
4.4 Magnetic Materials	p. 160
References	p. 161
5 Capacitors	p. 163
5.1 Introduction	p. 163
5.2 Capacitor Parameters	p. 165
5.2.1 Capacitor Value	p. 165
5.2.2 Effective Capacitance	p. 166
5.2.3 Tolerances	p. 166
5.2.4 Temperature Coefficient	p. 166
5.2.5 Quality Factor	p. 167
5.2.6 Equivalent Series Resistance	p. 167
5.2.7 Series and Parallel Resonances	p. 167
5.2.8 Dissipation Factor or Loss Tangent	p. 170
5.2.9 Time Constant	p. 170
5.2.10 Rated Voltage	p. 170
5.2.11 Rated Current	p. 170
5.3 Chip Capacitor Types	p. 171
5.3.1 Multilayer Dielectric Capacitor	p. 171
5.3.2 Multiplate Capacitor	p. 172
5.4 Discrete Parallel Plate Capacitor Analysis	p. 173
5.4.1 Vertically Mounted Series Capacitor	p. 173
5.4.2 Flat-Mounted Series Capacitor	p. 176
5.4.3 Flat-Mounted Shunt Capacitor	p. 177
5.4.4 Measurement-Based Model	p. 178
5.5 Voltage and Current Ratings	p. 181
5.5.1 Maximum Voltage Rating	p. 181
5.5.2 Maximum RF Current Rating	p. 181
5.5.3 Maximum Power Dissipation	p. 182
5.6 Capacitor Electrical Representation	p. 185
5.6.1 Series and Shunt Connections	p. 185
5.6.2 Network Representations	p. 187
References	p. 188
6 Monolithic Capacitors	p. 191
6.1 MIM Capacitor Models	p. 192
6.1.1 Simple Lumped Equivalent Circuit	p. 193
6.1.2 Coupled Microstrip-Based Distributed Model	p. 194
6.1.3 Single Microstrip-Based Distributed Model	p. 198
6.1.4 EC Model for MIM Capacitor on Si	p. 202
6.1.5 EM Simulations	p. 204
6.2 High-Density Capacitors	p. 206
6.2.1 Multilayer Capacitors	p. 208
6.2.2 Ultra-Thin-Film Capacitors	p. 211
6.2.3 High-K Capacitors	p. 212
6.2.4 Fractal Capacitors	p. 212
6.2.5 Ferroelectric Capacitors	p. 214
6.3 Capacitor Shapes	p. 216
6.3.1 Rectangular Capacitors	p. 217
6.3.2 Circular Capacitors	p. 218
6.3.3 Octagonal Capacitors	p. 218
6.4 Design Considerations	p. 220
6.4.1 Q-Enhancement Techniques	p. 220
6.4.2 Tunable Capacitor	p. 223
6.4.3 Maximum Power Handling	p. 223
References	p. 227
7 Interdigital Capacitors	p. 229
7.1 Interdigital Capacitor Models	p. 230
7.1.1 Approximate Analysis	p. 230
7.1.2 J-Inverter Network Equivalent Representation	p. 235
7.1.3 Full-Wave Analysis	p. 236
7.1.4 Measurement-Based Model	p. 238
7.2 Design Considerations	p. 239
7.2.1 Compact Size	p. 239
7.2.2 Multilayer Capacitor	p. 241
7.2.3 Q-Enhancement Techniques	p. 244
7.2.4 Voltage Tunable Capacitor	p. 247
7.2.5 High-Voltage Operation	p. 249
7.3 Interdigital Structure as a Photodetector	p. 249
References	p. 251
8 Resistors	p. 253
8.1 Introduction	p. 253
8.2 Basic Definitions	p. 255
8.2.1 Power Rating	p. 255
8.2.2 Temperature Coefficient	p. 256
8.2.3 Resistor Tolerances	p. 256
8.2.4 Maximum Working Voltage	p. 256
8.2.5 Maximum Frequency of Operation	p. 257
8.2.6 Stability	p. 257
8.2.7 Noise	p. 257
8.2.8 Maximum Current Rating	p. 257
8.3 Resistor Types	p. 257
8.3.1 Chip Resistors	p. 258
8.3.2 MCM Resistors	p. 258
8.3.3 Monolithic Resistors	p. 258
8.4 High-Power Resistors	p. 265
8.5 Resistor Models	p. 267
8.5.1 EC Model	p. 268
8.5.2 Distributed Model	p. 269
8.5.3 Meander Line Resistor	p. 270
8.6 Resistor Representations	p. 272
8.6.1 Network Representations	p. 272
8.6.2 Electrical Representations	p. 272
8.7 Effective Conductivity	p. 274
8.8 Thermistors	p. 276
References	p. 276
9 Via Holes	p. 279
9.1 Types of Via Holes	p. 279
9.1.1 Via Hole Connection	p. 279
9.1.2 Via Hole Ground	p. 281
9.2 Via Hole Models	p. 282
9.2.1 Analytical Expression	p. 283
9.2.2 Quasistatic Method	p. 284
9.2.3 Parallel Plate Waveguide Model	p. 286
9.2.4 Method of Moments	p. 287
9.2.5 Measurement-Based Model	p. 289
9.3 Via Fence	p. 290
9.3.1 Coupling Between Via Holes	p. 293
9.3.2 Radiation from Via Ground Plug	p. 293
9.4 Plated Heat Sink Via	p. 294
9.5 Via Hole Layout	p. 294
References	p. 296
10 Airbridges and Dielectric Crossovers	p. 299
10.1 Airbridge and Crossover	p. 299
10.2 Analysis Techniques	p. 301
10.2.1 Quasistatic Method	p. 301
10.2.2 Full-Wave Analysis	p. 306
10.3 Models	p. 308
10.3.1 Analytical Model	p. 308
10.3.2 Measurement-Based Model	p. 310
References	p. 315
11 Transformers and Baluns	p. 317
11.1 Basic Theory	p. 318
11.1.1 Parameters Definition	p. 318
11.1.2 Analysis of Transformers	p. 319
11.1.3 Ideal Transformers	p. 322
11.1.4 Equivalent Circuit Representation	p. 323
11.1.5 Equivalent Circuit of a Practical Transformer	p. 325
11.1.6 Wideband Impedance Matching Transformers	p. 326
11.1.7 Types of Transformers	p. 329
11.2 Wire-Wrapped Transformers	p. 329
11.2.1 Tapped Coil Transformers	p. 329
11.2.2 Bond Wire Transformer	p. 332
11.3 Transmission-Line Transformers	p. 332
11.4 Ferrite Transformers	p. 336
11.5 Parallel Conductor Winding Transformers on Si Substrate	p. 339
11.6 Spiral Transformers on GaAs Substrate	p. 341
11.6.1 Triformer Balun	p. 344
11.6.2 Planar-Transformer Balun	p. 345
References	p. 349
12 Lumped-Element Circuits	p. 353
12.1 Passive Circuits	p. 353
12.1.1 Filters	p. 353
12.1.2 Hybrids and Couplers	p. 356
12.1.3 Power Dividers/Combiners	p. 370
12.1.4 Matching Networks	p. 372
12.1.5 Lumped-Element Biasing Circuit	p. 377
12.2 Control Circuits	p. 380
12.2.1 Switches	p. 381
12.2.2 Phase Shifters	p. 387
12.2.3 Digital Attenuator	p. 390
References	p. 392
13 Fabrication Technologies	p. 395
13.1 Introduction	p. 395
13.1.1 Materials	p. 396
13.1.2 Mask Layouts	p. 401
13.1.3 Mask Fabrication	p. 401
13.2 Printed Circuit Boards	p. 402
13.2.1 PCB Fabrication	p. 404
13.2.2 PCB Inductors	p. 405
13.3 Microwave Printed Circuits	p. 405
13.3.1 MPC Fabrication	p. 407
13.3.2 MPC Applications	p. 408
13.4 Hybrid Integrated Circuits	p. 410
13.4.1 Thin-Film MICs	p. 410
13.4.2 Thick-Film Technology	p. 412
13.4.3 Cofired Ceramic and Glass-Ceramic Technology	p. 414
13.5 GaAs MICs	p. 416
13.5.1 MMIC Fabrication	p. 418
13.5.2 MMIC Example	p. 421
13.6 CMOS Fabrication	p. 421
13.7 Micromachining Fabrication	p. 424
References	p. 425
14 Microstrip Overview	p. 429
14.1 Design Equations	p. 429
14.1.1 Characteristic Impedance and Effective Dielectric Constant	p. 429
14.1.2 Effect of Strip Thickness	p. 431
14.2 Design Considerations	p. 432
14.2.1 Effect of Dispersion	p. 433
14.2.2 Microstrip Losses	p. 433
14.2.3 Quality Factor Q	p. 435
14.2.4 Enclosure Effect	p. 438
14.2.5 Frequency Range of Operation	p. 443
14.2.6 Power-Handling Capability	p. 444
14.3 Coupled Microstrip Lines	p. 456
14.3.1 Even-Mode Capacitance	p. 457
14.3.2 Odd-Mode Capacitance	p. 458
14.3.3 Characteristic Impedances	p. 459
14.3.4 Effective Dielectric Constants	p. 459
14.4 Microstrip Discontinuities	p. 460
14.5 Compensated Microstrip Discontinuities	p. 461
14.5.1 Step-in-Width	p. 461
14.5.2 Chamfered Bend	p. 462
14.5.3 T-Junction	p. 463
References	p. 465
Appendix	p. 469
About the Author	p. 471
Index	p. 473

Available:*

On Order

Summary

Summary

Author Notes

Table of Contents