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Cover image for Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint
Title:
Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint
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Publication Information:
Skudai : Universiti Teknologi Malaysia, 2006
Physical Description:
1v + 1 CD-ROM
General Note:
Also available in compact disc version : CP 12540 ra
Electronic Access:
Full text
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

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FKM30000001786 TS226 T36 2006 Closed Access Thesis UTM Project Paper (Closed Access)
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30000010083705 TS226 T36 2006 Closed Access Thesis UTM Project Paper (Closed Access)
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