Title:
Microelectronics failure analysis desk reference
Edition:
5th ed.
Publication Information:
Materials Park, OH : ASM International, 2004
Physical Description:
1 CD-ROM ; 12 cm.
ISBN:
9780871708045
General Note:
Accompanies text of the same title : TK7874.58 M52 2004 f
Added Corporate Author:
Available:*
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Summary
Summary
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Table of Contents
General | |
Chapter 1 Introduction | |
Foreword | p. x |
The Microelectronics Desk Reference | p. xi |
Chapter 2 Failure Analysis Process Flow | |
The Failure Analysis Process | p. 1 |
System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in today's High Speed, Low Cost PC environment | p. 15 |
Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products | p. 22 |
Failure Analysis Flow for Package Failure | p. 33 |
Wafer Level Failure Analysis Process Flow | p. 39 |
Flip-Chip and "Backside" Sample Preparation Techniques | p. 42 |
Failure Analysis in a Fabless/Outsourced World | p. 49 |
Circuit Edit at First Silicon | p. 58 |
The Process of Editing Circuits Through the Bulk Silicon | p. 71 |
Chapter 3 Failure Verification | |
Curve Tracer Data Interpretation for Failure Analysis | p. 76 |
A Primer on Simple Device Problems and Curve Tracer Characteristics | p. 86 |
Electronics and Failure Analysis | p. 89 |
Analog Device and Circuit Characterization | p. 110 |
IC Testing: Background, Directions and Opportunities for Failure Analysis | p. 122 |
Using Scan Based Techniques for Fault Isolation in Logic Devices | p. 132 |
Chapter 4 Failure Mode - Failure Classifications | |
The Power of Semiconductor Memory Failure Signature Analysis | p. 139 |
Common Defects Encountered During Semiconductor Manufacturing | p. 146 |
System Level Board Fabrication and Assembly Process anomalies and Associated Failure Categories | p. 152 |
Characterization of Anomalies in Flip-Chip Solder Joins in Ceramic Packaging | p. 157 |
Identification of Latent Defects in Advanced Glass Ceramic MCM Packaging | p. 162 |
Electrostatic Discharge (ESD) and Latchup Failures in Advanced CMOS Technologies | p. 167 |
Electrical and Optical Characterization of Latchup | p. 174 |
Chapter 5 Special Devices | |
Failure Analysis of Microelectromechanical Systems (MEMS) | p. 193 |
Failure Analysis of Passive Components | p. 219 |
Failure Analysis and Reliability of Optoelectronic Devices | p. 229 |
Fault Localization - Package Level | |
Chapter 6 Non-Destructive Analysis Techniques | |
Die-level Fault Localization with X-ray Microscopy | p. 253 |
X-ray Microtomography Tools for Advanced IC Packaging Failure Analysis | p. 260 |
Acoustic Microscopy of Semiconductor Packages | p. 268 |
Electronic Package Fault Isolation Using TDR | p. 289 |
Current Imaging using Magnetic Field Sensors | p. 303 |
Fault Localization - Die Level | |
Chapter 7 Depackaging | |
Chip access techniques | p. 312 |
Low Stress FA Sample Preparation of Flip Chip Devices with Low-K Dielectric Interconnect Layers | p. 323 |
Plastic BGA Module FA Process Flow Development | p. 329 |
Chip-Scale Packages and Their Failure Analysis Challenges | p. 332 |
Backside Analysis Using Re-Package Techniques | p. 341 |
Chapter 8 Photon Emission (Electroluminescence) Localization Techniques | |
Photon Emission Microscopy | p. 347 |
Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for, Analysis of Electronic Circuit and Device Functionality | p. 356 |
Picosecond Imaging Circuit Analysis - PICA | p. 369 |
Chapter 9 Microthermography | |
Thermal Defect Detection Techniques | p. 378 |
Thermal Failure Analysis by IR Lock-in Thermography | p. 398 |
Chapter 10 Laser and Particle Beam-Based Localization Techniques | |
Beam-Based Defect Localization Methods | p. 406 |
Principles of Thermal Laser Stimulation Techniques | p. 417 |
Introduction to Laser Voltage Probing (LVP) of Integrated Circuits | p. 426 |
SEM and FIB Passive Voltage Contrast | p. 431 |
Electron Beam Probing | p. 438 |
Deprocessing and Imaging Techniques | |
Chapter 11 Deprocessing | |
Delayering Techniques: Dry Processes, Wet Chemical Processing and Parallel Lapping | p. 444 |
Plasma Delayering of Intergrated Circuits | p. 464 |
The Art of Cross Sectioning | p. 473 |
Delineation Etching of Semiconductor Cross Sections | p. 493 |
Special Techniques for Backside Deprocessing | p. 496 |
Deprocessing Techniques for Copper, Low K, and SOI Devices | p. 501 |
PCB SMT Solder Joint Failure Analysis | p. 513 |
Improved Methodologies for Identifying Root-Cause of Printed Board Failures | p. 523 |
Chapter 12 General Imaging Techniques | |
Optical Microscopy | p. 540 |
Scanning Electron Microscopy | p. 559 |
Ultra-high Resolution in the Scanning Electron Microscope | p. 574 |
Chapter 13 Local Deprocessing and Imaging | |
Focused Ion Beam (FIB) Systems: A Brief Overview | p. 583 |
Transmission Electron Microscopy for Failure Analysis of Integrated Circuits | p. 595 |
Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy | p. 615 |
Chapter 14 Materials Analysis Techniques | |
Energy Dispersive X-ray Analysis | p. 628 |
Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) | p. 640 |
SIMS Solutions for Next Generation IC Processes and Devices | p. 652 |
Chapter 15 Important Topics for Semiconductor Devices | |
Submicron CMOS Devices | p. 662 |
Reliability and Quality Concepts for Failure Analysts | p. 672 |
CAD Navigation in FA and Design/Test Data for Fast Fault Isolation | p. 676 |
Best of the EDFAS E-mail Discussion Forum 2000-2004 | p. 684 |
Chapter 16 FA Techniques/Tools Roadmaps | |
Failure Analysis Roadmaps | p. 701 |
Assembly Analytical Forum Analytical Tool Roadmap | p. 705 |
Chapter 17 FA Operation and Management | |
Education and Training for the Analyst | p. 717 |
Managing the Unpredictable - A Business Model for Failure Analysis Service | p. 722 |
Management Principles and Practices for the Failure Analysis Laboratory | p. 730 |
Education/Training Sources and References | p. 740 |
Chapter 18 Appendix | |
Failure Analysis Terms and Definitions | p. 743 |
JEDEC Standards for Failure Analysis | p. 759 |
ISTFA Subject Index | p. 761 |
Author Index | p. 799 |