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Cover image for Design and fabrication of an integrated circuit (IC) mould
Title:
Design and fabrication of an integrated circuit (IC) mould
Personal Author:
Publication Information:
Sekudai : UTM, 1993
Physical Description:
1 reel : positive ; 35 mm
General Note:
1 judul dalam 1 mikrofilem
Added Author:
DSP_DISSERTATION:
Project paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 1993

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Material Type
Item Category 1
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30000003869520 MFL 8420 ra Non Circulating Microfilm Microfilm
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