Cover image for Quality improvement of solder paste printing process using six sigma methodology
Title:
Quality improvement of solder paste printing process using six sigma methodology
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TS156 W664 2005
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005

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30000010094791 CP 4493 UTM Special Collection - Computer File Full text UTM Thesis
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