Electromagnetic compatibility engineering

"Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others."
-- EE Times

Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems.

While maintaining and updating the core information--such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD--that made the previous book such a wide success, this new book includes additional coverage of:

Equipment/systems grounding

Switching power supplies and variable-speed motor drives

Digital circuit power distribution and decoupling

PCB layout and stack-up

Mixed-signal PCB layout

RF and transient immunity

Power line disturbances

Precompliance EMC measurements

New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems

The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum.

Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.

Author Notes

Henry W. Ott is President and Principal Consultant of Henry Ott Consultants, an EMC/ESD training and consulting organization located in Livingston, New Jersey. Mr. Ott is considered by many to be the nation's leading EMC educator.

Preface	p. xxiii
Part 1 EMC Theory	p. 1
1 Electromagnetic Compatibility	p. 3
1.1 Introduction	p. 3
1.2 Noise and Interference	p. 3
1.3 Designing for Electromagnetic Compatibility	p. 4
1.4 Engineering Documentation and EMC	p. 6
1.5 United States' EMC Regulations	p. 6
1.5.1 FCC Regulations	p. 6
1.5.2 FCC Part 15, Subpart B	p. 8
1.5.3 Emissions	p. 11
1.5.4 Administrative Procedures	p. 14
1.5.5 Susceptibility	p. 17
1.5.6 Medical Equipment	p. 17
1.5.7 Telecom	p. 18
1.5.8 Automotive	p. 19
1.6 Canadian EMC Requirements	p. 19
1.7 European Union's EMC Requirements	p. 20
1.7.1 Emission Requirements	p. 20
1.7.2 Harmonics and Flicker	p. 22
1.7.3 Immunity Requirements	p. 23
1.7.4 Directives and Standards	p. 23
1.8 International Harmonization	p. 26
1.9 Military Standards p. 27
1.10 Avionics p. 28
1.11 The Regulatory Process	p. 30
1.12 Typical Noise Path	p. 30
1.13 Methods of Noise Coupling	p. 31
1.13.1 Conductively Coupled Noise	p. 31
1.13.2 Common Impedance Coupling	p. 32
1.13.3 Electric and Magnetic Field Coupling	p. 33
1.14 Miscellaneous Noise Sources	p. 33
1.14.1 Galvanic Action	p. 33
1.14.2 Electrolytic Action	p. 35
1.14.3 Triboelectric Effect	p. 35
1.14.4 Conductor Motion	p. 36
1.15 Use of Network Theory	p. 36
Summary	p. 38
Problems	p. 39
References	p. 41
Further Reading	p. 42
2 Cabling	p. 44
2.1 Capacitive Coupling	p. 45
2.2 Effect of Shield on Capacitive Coupling	p. 48
2.3 Inductive Coupling	p. 52
2.4 Mutual Inductance Calculations	p. 54
2.5 Effect of Shield on Magnetic Coupling	p. 56
2.5.1 Magnetic Coupling Between Shield and Inner Conductor	p. 58
2.5.2 Magnetic Coupling-Open Wire to Shielded Conductor	p. 61
2.6 Shielding to Prevent Magnetic Radiation	p. 64
2.7 Shielding a Receptor Against Magnetic Fields	p. 67
2.8 Common Impedance Shield Coupling	p. 69
2.9 Experimental Data p. 70
2.10 Example of Selective Shielding p. 74
2.11 Shield Transfer Impedance	p. 75
2.12 Coaxial Cable Versus Twisted Pair	p. 75
2.13 Braided Shields	p. 79
2.14 Spiral Shields	p. 81
2.15 Shield Terminations	p. 84
2.15.1 Pigtails	p. 84
2.15.2 Grounding of Cable Shields	p. 88
2.16 Ribbon Cables	p. 94
2.17 Electrically Long Cables	p. 96
Summary	p. 96
Problems	p. 98
References	p. 103
Further Reading	p. 104
3 Grounding	p. 106
3.1 AC Power Distribution and Safety Grounds	p. 107
3.1.1 Service Entrance	p. 108
3.1.2 Branch Circuits	p. 109
3.1.3 Noise Control	p. 111
3.1.4 Earth Grounds	p. 114
3.1.5 Isolated Grounds	p. 116
3.1.6 Separately Derived Systems	p. 118
3.1.7 Grounding Myths	p. 119
3.2 Signal Grounds	p. 120
3.2.1 Single-Point Ground Systems	p. 124
3.2.2 Multipoint Ground Systems	p. 126
3.2.3 Common Impedance Coupling	p. 128
3.2.4 Hybrid Grounds	p. 130
3.2.5 Chassis Grounds	p. 131
3.3 Equipment/System Grounding	p. 132
3.3.1 Isolated Systems	p. 133
3.3.2 Clustered Systems	p. 133
3.3.3 Distributed Systems	p. 140
3.4 Ground Loops	p. 142
3.5 Low-Frequency Analysis of Common-Mode Choke	p. 147
3.6 High-Frequency Analysis of Common-Mode Choke	p. 152
3.7 Single Ground Reference for a Circuit	p. 154
Summary	p. 155
Problems	p. 156
References	p. 157
Further Reading	p. 157
4 Balancing and Filtering	p. 158
4.1 Balancing	p. 158
4.1.1 Common-Mode Rejection Ratio	p. 161
4.1.2 Cable Balance	p. 165
4.1.3 System Balance	p. 166
4.1.4 Balanced Loads	p. 166
4.2 Filtering	p. 174
4.2.1 Common-Mode Filters	p. 174
4.2.2 Parasitic Effects in Filters	p. 177
4.3 Power Supply Decoupling	p. 178
4.3.1 Low-Frequency Analog Circuit Decoupling	p. 183
4.3.2 Amplifier Decoupling	p. 185
4.4 Driving Capacitive Loads	p. 186
4.5 System Bandwidth	p. 188
4.6 Modulation and Coding	p. 190
Summary	p. 190
Problems	p. 191
References	p. 192
Further Reading	p. 193
5 Passive Components	p. 194
5.1 Capacitors	p. 194
5.1.1 Electrolytic Capacitors	p. 195
5.1.2 Film Capacitors	p. 197
5.1.3 Mica and Ceramic Capacitors	p. 198
5.1.4 Feed-Through Capacitors	p. 200
5.1.5 Paralleling Capacitors	p. 202
5.2 Inductors	p. 203
5.3 Transformers	p. 204
5.4 Resistors	p. 206
5.4.1 Noise in Resistors	p. 207
5.5 Conductors	p. 208
5.5.1 Inductance of Round Conductors	p. 209
5.5.2 Inductance of Rectangular Conductors	p. 210
5.5.3 Resistance of Round Conductors	p. 211
5.5.4 Resistance of Rectangular Conductors	p. 213
5.6 Transmission Lines	p. 215
5.6.1 Characteristic Impedance	p. 217
5.6.2 Propagation Constant	p. 220
5.6.3 High-Frequency Loss	p. 221
5.6.4 Relationship Among C, L and ¿r.	p. 224
5.6.5 Final Thoughts	p. 225
5.7 Ferrites	p. 225
Summary	p. 233
Problems	p. 234
References	p. 237
Further Reading	p. 237
6 Shielding	p. 238
6.1 Near Fields and Far Fields	p. 238
6.2 Characteristic and Wave Impedances	p. 241
6.3 Shielding Effectiveness	p. 243
6.4 Absorption Loss	p. 245
6.5 Reflection Loss	p. 249
6.5.1 Reflection Loss to Plane Waves	p. 252
6.5.2 Reflection Loss in the Near Field	p. 253
6.5.3 Electric Field Reflection Loss	p. 254
6.5.4 Magnetic Field Reflection Loss	p. 255
6.5.5 General Equations for Reflection Loss	p. 256
6.5.6 Multiple Reflections in Thin Shields	p. 256
6.6 Composite Absorption and Reflection Loss	p. 257
6.6.1 Plane Waves	p. 257
6.6.2 Electric Fields	p. 258
6.6.3 Magnetic Fields	p. 259
6.7 Summary of Shielding Equations	p. 260
6.8 Shielding with Magnetic Materials	p. 260
6.9 Experimental Data p. 265
6.10 Apertures p. 267
6.10.1 Multiple Apertures	p. 270
6.10.2 Seams	p. 273
6.10.3 Transfer Impedance	p. 277
6.11 Waveguide Below Cutoff	p. 280
6.12 Conductive Gaskets	p. 282
6.12.1 Joints of Dissimilar Metals	p. 283
6.12.2 Mounting of Conductive Gaskets	p. 284
6.13 The "Ideal" Shield	p. 287
6.14 Conductive Windows	p. 288
6.14.1 Transparent Conductive Coatings	p. 288
6.14.2 Wire Mesh Screens	p. 289
6.14.3 Mounting of Windows	p. 289
6.15 Conductive Coatings	p. 289
6.15.1 Conductive Paints	p. 291
6.15.2 Flame/Arc Spray	p. 291
6.15.3 Vacuum Metalizing	p. 291
6.15.4 Electroless Plating	p. 292
6.15.5 Metal Foil Linings	p. 292
6.15.6 Filled Plastic	p. 293
6.16 Internal Shields	p. 293
6.17 Cavity Resonance	p. 295
6.18 Grounding of Shields	p. 296
Summary	p. 296
Problems	p. 297
References	p. 299
Further Reading	p. 300
7 Contact Protection	p. 302
7.1 Glow Discharges	p. 302
7.2 Metal-Vapor or Arc Discharges	p. 303
7.3 AC Versus DC Circuits	p. 305
7.4 Contact Material	p. 306
7.5 Contact Rating	p. 306
7.6 Loads with High Inrush Currents	p. 307
7.7 Inductive Loads	p. 308
7.8 Contact Protection Fundamentals	p. 310
7.9 Transient Suppression for Inductive Loads p. 314
7.10 Contact Protection Networks for Inductive Loads p. 318
7.10.1 C Network	p. 318
7.10.2 R-C Network	p. 318
7.10.3 R-C-D Network	p. 321
7.11 Inductive Loads Controlled by a Transistor Switch	p. 322
7.12 Resistive Load Contact Protection	p. 323
7.13 Contact Protection Selection Guide	p. 323
7.14 Examples	p. 324
Summary	p. 325
Problems	p. 326
References	p. 327
Further Reading	p. 327
8 Intrinsic Noise Sources	p. 328
8.1 Thermal Noise	p. 328
8.2 Characteristics of Thermal Noise	p. 332
8.3 Equivalent Noise Bandwidth	p. 334
8.4 Shot Noise	p. 337
8.5 Contact Noise	p. 338
8.6 Popcorn Noise	p. 339
8.7 Addition of Noise Voltages	p. 340
8.8 Measuring Random Noise	p. 341
Summary	p. 342
Problems	p. 343
References	p. 345
Further Reading	p. 345
9 Active Device Noise	p. 346
9.1 Noise Factor	p. 346
9.2 Measurement of Noise Factor	p. 349
9.2.1 Single-Frequency Method	p. 349
9.2.2 Noise Diode Method	p. 350
9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor	p. 351
9.4 Noise Voltage and Current Model	p. 353
9.5 Measurment of Vn and In	p. 355
9.6 Calculating Noise Factor and S/N Radio from Vn-In	p. 356
9.7 Optimum Source Resistance	p. 357
9.8 Noise Factor of Cascaded Stages	p. 360
9.9 Noise Temperature p. 362
9.10 Bipolar Transistor Noise p. 364
9.10.1 Transistor Noise Factor	p. 365
9.10.2 Vn-In for Transistors	p. 367
9.11 Field-Effect Transistor Noise	p. 368
9.11.1 FET Noise Factor	p. 368
9.11.2 Vn-In Representation of FET Noise	p. 370
9.12 Noise in Operational Amplifiers	p. 370
9.12.1 Methods of Specifying Op-Amp Noise	p. 373
9.12.2 Op-Amp Noise Factor	p. 375
Summary	p. 375
Problems	p. 376
References	p. 377
Further Reading	p. 378
10 Digital Circuit Grounding p. 379
10.1 Frequency Versus Time Domain	p. 380
10.2 Analog Versus Digital Circuits	p. 380
10.3 Digital Logic Noise	p. 380
10.4 Internal Noise Sources	p. 381
10.5 Digital Circuit Ground Noise	p. 384
10.5.1 Minimizing Inductance	p. 385
10.5.2 Mutual Inductance	p. 386
10.5.3 Practical Digital Circuit Ground Systems	p. 388
10.5.4 Loop Area	p. 390
10.6 Ground Plane Current Distribution and Impedance	p. 391
10.6.1 Reference Plane Current Distribution	p. 392
10.6.2 Ground Plane Impedance	p. 400
10.6.3 Ground Plane Voltage	p. 408
10.6.4 End Effects	p. 409
10.7 Digital Logic Current Flow	p. 412
10.7.1 Microstrip Line	p. 414
10.7.2 Stripline	p. 415
10.7.3 Digital Circuit Current Flow Summary	p. 418
Summary	p. 419
Problems	p. 420
References	p. 421
Further Reading	p. 422
Part 2 EMC Applications	p. 423
11 Digital Circuit Power Distribution	p. 425
11.1 Power Supply Decoupling	p. 425
11.2 Transient Power Supply Currents	p. 426
11.2.1 Transient Load Current	p. 428
11.2.2 Dynamic Internal Current	p. 428
11.2.3 Fourier Spectrum of the Transient Current	p. 429
11.2.4 Total Transient Current	p. 431
11.3 Decoupling Capacitors	p. 431
11.4 Effective Decoupling Strategies	p. 436
11.4.1 Multiple Decoupling Capacitors	p. 437
11.4.2 Multiple Capacitors of the Same Value	p. 437
11.4.3 Multiple Capacitors of Two Different Values	p. 440
11.4.4 Multiple Capacitors of Many Different Values	p. 444
11.4.5 Target Impedance	p. 445
11.4.6 Embedded PCB Capacitance	p. 447
11.4.7 Power Supply Isolation	p. 452
11.5 The Effect of Decoupling on Radiated Emissions	p. 454
11.6 Decoupling Capacitor Type and Value	p. 456
11.7 Decoupling Capacitor Placement and Mounting	p. 457
11.8 Bulk Decoupling Capacitors	p. 459
11.9 Power Entry Filters	p. 460
Summary	p. 461
Problems	p. 461
References	p. 463
Further Reading	p. 463
12 Digital Circuit Radiation	p. 464
12.1 Differential-Mode Radiation	p. 465
12.1.1 Loop Area	p. 468
12.1.2 Loop Current	p. 468
12.1.3 Fourier Series	p. 468
12.1.4 Radiated Emission Envelope	p. 470
12.2 Controlling Differential-Mode Radiation	p. 471
12.2.1 Board Layout	p. 471
12.2.2 Canceling Loops	p. 474
12.2.3 Dithered Clocks	p. 475
12.3 Common-Mode Radiation	p. 477
12.4 Controlling Common-Mode Radiation	p. 480
12.4.1 Common-Mode Voltage	p. 481
12.4.2 Cable Filtering and Shielding	p. 482
12.4.3 Separate I/O Grounds	p. 485
12.4.4 Dealing With Common-Mode Radiation Issues	p. 488
Summary	p. 488
Problems	p. 489
References	p. 490
Further Reading	p. 491
13 Conducted Emissions	p. 492
13.1 Power Line Impedance	p. 492
13.1.1 Line Impedance Stabilization Network	p. 494
13.2 Switched-Mode Power Supplies	p. 495
13.2.1 Common-Mode Emissions	p. 498
13.2.2 Differential-Mode Emissions	p. 501
13.2.3 DC-to-DC Converters	p. 509
13.2.4 Rectifier Diode Noise	p. 509
13.3 Power-Line Filters	p. 511
13.3.1 Common-Mode Filtering	p. 512
13.3.2 Differential-Mode Filtering	p. 512
13.3.3 Leakage Inductance	p. 513
13.3.4 Filter Mounting	p. 516
13.3.5 Power Supplies with Integral Power-Line Filters	p. 519
13.3.6 High-Frequency Noise	p. 520
13.4 Primary-to-Secondary Common-Mode Coupling	p. 523
13.5 Frequency Dithering	p. 524
13.6 Power Supply Instability	p. 524
13.7 Magnetic Field Emissions	p. 525
13.8 Variable Speed Motor Drives	p. 528
13.9 Harmonic Suppression	p. 536
13.9.1 Inductive Input Filters	p. 538
13.9.2 Active Power Factor Correction	p. 538
13.9.3 AC Line Reactors	p. 539
Summary	p. 541
Problems	p. 542
References	p. 544
Further Reading	p. 544
14 RF and Transient Immunity	p. 545
14.1 Performance Criteria	p. 545
14.2 RF Immunity	p. 546
14.2.1 The RF Environment	p. 547
14.2.2 Audio Rectification	p. 548
14.2.3 RFI Mitigation Techniques	p. 549
14.3 Transient Immunity	p. 557
14.3.1 Electrostatic Discharge	p. 558
14.3.2 Electrical Fast Transient	p. 558
14.3.3 Lightning Surge	p. 559
14.3.4 Transient Suppression Networks	p. 560
14.3.5 Signal Line Suppression	p. 561
14.3.6 Protection of High-Speed Signal Lines	p. 564
14.3.7 Power Line Transient Suppression	p. 566
14.3.8 Hybrid Protection Network	p. 570
14.4 Power Line Disturbances	p. 572
14.4.1 Power Line Immunity Curve	p. 573
Summary	p. 575
Problems	p. 576
References	p. 578
Further Reading	p. 579
15 Electrostatic Discharge	p. 580
15.1 Static Generation	p. 580
15.1.1 Inductive Charging	p. 583
15.1.2 Energy Storage	p. 585
15.2 Human Body Model	p. 587
15.3 Static Discharge	p. 589
15.3.1 Decay Time	p. 590
15.4 ESD Protection in Equipment Design	p. 592
15.5 Preventing ESD Entry	p. 594
15.5.1 Metallic Enclosures	p. 595
15.5.2 Input/Output Cable Treatment	p. 599
15.5.3 Insulated Enclosures	p. 604
15.5.4 Keyboards and Control Panels	p. 607
15.6 Hardening Sensitive Circuits	p. 608
15.7 ESD Grounding	p. 608
15.8 Nongrounded Products	p. 609
15.9 Field-Induced Upset	p. 610
15.9.1 Inductive Coupling	p. 611
15.9.2 Capacitive Coupling	p. 611
15.10 Transient Hardened Software Design	p. 612
15.10.1 Detecting Errors in Program Flow	p. 613
15.10.2 Detecting Errors in Input/Output	p. 614
15.10.3 Detecting Errors in Memory	p. 616
15.11 Time Windows	p. 617
Summary	p. 617
Problems	p. 619
References	p. 620
Further Reading	p. 621
16 PCB Layout and Stackup	p. 622
16.1 General PCB Layout Considerations	p. 622
16.1.1 Partitioning	p. 622
16.1.2 Keep Out Zones	p. 622
16.1.3 Critical Signals	p. 623
16.1.4 System Clocks	p. 624
16.2 PCB-to-Chassis Ground Connection	p. 625
16.3 Return Path Discontinuities	p. 626
16.3.1 Slots in Ground/Power Planes	p. 627
16.3.2 Split Ground/Power Planes	p. 628
16.3.3 Changing Reference Planes	p. 630
16.3.4 Referencing the Top and Bottom of the Same Plane	p. 633
16.3.5 Connectors	p. 634
16.3.6 Ground Fill	p. 634
16.4 PCB Layer Stackup	p. 635
16.4.1 One- and Two-Layer Boards	p. 636
16.4.2 Multilayer Boards	p. 637
16.4.3 General PCB Design Procedure	p. 653
Summary	p. 655
Problems	p. 657
References	p. 658
Further Reading	p. 658
17 Mixed-Signal PCB Layout	p. 660
17.1 Split Ground Planes	p. 660
17.2 Microstrip Ground Plane Current Distribution	p. 662
17.3 Analog and Digital Ground Pins	p. 665
17.4 When Should Split Ground Planes Be Used?	p. 668
17.5 Mixed Signal ICs	p. 669
17.5.1 Multi-Board Systems	p. 671
17.6 High-Resolution A/D and D/A Converters	p. 671
17.6.1 Stripline	p. 673
17.6.2 Asymmetric Stripline	p. 674
17.6.3 Isolated Analog and Digital Ground Planes	p. 675
17.7 A/D and D/A Converter Support Circuitry	p. 676
17.7.1 Sampling Clocks	p. 676
17.7.2 Mixed-Signal Support Circuitry	p. 678
17.8 Vertical Isolation	p. 679
17.9 Mixed-Signal Power Distribution	p. 681
17.9.1 Power Distribution	p. 681
17.9.2 Decoupling	p. 682
17.10 The IPC Problem	p. 684
Summary	p. 685
Problems	p. 686
References	p. 687
Further Reading	p. 687
18 Precompliance EMC Measurements	p. 688
18.1 Test Environment	p. 689
18.2 Antennas Versus Probes	p. 689
18.3 Common-Mode Currents on Cables	p. 690
18.3.1 Test Procedure	p. 693
18.3.2 Cautions	p. 693
18.4 Near Field Measurements	p. 694
18.4.1 Test Procedure	p. 695
18.4.2 Cautions	p. 696
18.4.3 Seams and Apertures in Enclosures	p. 697
18.5 Noise Voltage Measurements	p. 697
18.5.1 Balanced Differential Probe	p. 698
18.5.2 DC to 1-GHz Probe	p. 700
18.5.3 Cautions	p. 700
18.6 Conducted Emission Testing	p. 700
18.6.1 Test Procedure	p. 702
18.6.2 Cautions	p. 703
18.6.3 Separating C-M from D-M Noise	p. 704
18.7 Spectrum Analyzers	p. 707
18.7.1 Detector Functions	p. 709
18.7.2 General Test Procedure	p. 710
18.8 EMC Crash Cart	p. 711
18.8.1 Mitigation Parts List	p. 712
18.9 One-Meter Radiated Emission Measurements	p. 713
18.9.1 Test Environment	p. 713
18.9.2 Limits for 1-m Testing	p. 713
18.9.3 Antennas for 1-m Testing	p. 714
18.10 Precompliance Immunity Testing	p. 717
18.10.1 Radiated Immunity	p. 717
18.10.2 Conducted Immunity	p. 720
18.10.3 Transient Immunity	p. 721
18.11 Precompliance Power Quality Tests	p. 723
18.11.1 Harmonics	p. 724
18.11.2 Flicker	p. 725
18.12 Margin	p. 726
18.12.1 Radiated Emission Margin	p. 726
18.12.2 Electrostatic Discharge Margin	p. 727
Summary	p. 728
Problems	p. 729
References	p. 730
Further Reading	p. 731
Appendix	p. 733
A The Decibel	p. 733
A.1 Properties of Logarithms	p. 733
A.2 Using the Decibel for Other than Power Measurements	p. 734
A.3 Power Loss or Negative Power Gain	p. 736
A.4 Absolute Power Level	p. 736
A.5 Summing Powers Expressed in Decibels	p. 738
B The Ten Best Ways to Maximize the Emission from Your Product	p. 740
C Multiple Reflections of Magnetic Fields in Thin Shields	p. 743
D Dipoles for Dummies	p. 746
D.1 Basic Dipoles for Dummies	p. 746
D.2 Intermediate Dipoles for Dummies	p. 751
D.3 Advanced Dipoles for Dummies	p. 756
D.3.1 Impedance of a Dipole	p. 756
D.3.2 Dipole Resonance	p. 756
D.3.3 Receiving Dipole	p. 759
D.3.4 Theory of Images	p. 759
D.3.5 Dipole Arrays	p. 761
D.3.6 Very High-Frequency Dipoles	p. 763
Summary	p. 763
Further Reading	p. 764
E Partial Inductance	p. 765
E.1 Inductance	p. 765
E.2 Loop Inductance	p. 767
E.2.1 Inductance of a Rectangular Loop	p. 768
E.3 Partial Inductance	p. 770
E.3.1 Partial Self-Inductance	p. 771
E.3.2 Partial Mutual Inductance	p. 773
E.3.3 Net Partial-Inductance	p. 776
E.3.4 Partial Inductance Applications	p. 776
E.3.5 Transmission Line Example	p. 778
E.4 Ground Plane Inductance Measurement Test Setup	p. 780
E.5 Inductance Notation	p. 785
Summary	p. 788
References	p. 788
Further Reading	p. 789
F Answers to Problems	p. 790
Index	p. 825

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