Title:
Adhesion of fourteen milimeters chip seal at different aggregate and binder rates
Personal Author:
Publication Information:
2011
Physical Description:
xiii, 55 p. : ill. (some colors). ; 30 cm.
General Note:
Also available in CD-ROM : CP 052163 ra
Fulltext is available at http://dms.library.utm.my:8080
Supervisor : Dr. Haryati Yaacob
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Awam)) - Universiti Teknologi Malaysia, 2011
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKA30000007125 | XX(767243.1) | Reference Book | UTM Project Paper (Open Shelves) | Searching... |
Searching... | 30000010263222 | QC183 N53 2011 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
