Cover image for Adhesion of fourteen milimeters chip seal at different aggregate and binder rates
Title:
Adhesion of fourteen milimeters chip seal at different aggregate and binder rates
Publication Information:
2011
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : QC183 N53 2011 raf

Supervisor : Dr. Haryati Yaacob
Subject Term:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Awam)) - Universiti Teknologi Malaysia, 2011

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30000010263223 CP 052163 ra UTM Special Collection - Computer File UTM Project Paper (Closed Access)
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