Cover image for Effect of aggregate moisture on adhesion of chip seal
Title:
Effect of aggregate moisture on adhesion of chip seal
Publication Information:
2012
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TE270 N87 2012 raf

Supervisor : Dr. Haryati Yaacob
Subject Term:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2012

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30000010276371 CP 027343 ra UTM Special Collection - Computer File UTM Thesis (Closed Access)
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