Title:
Effect of bismuth doping on intermetallic compound between Sn-Ag-Cu and Sn-Ag solders on electroless nickel (phosphorus)/immersion gold surface finish
Personal Author:
Publication Information:
2012
Physical Description:
xiii, 69 p. : ill (some col.). ; 30 cm.
General Note:
Supervisor : Prof. Dr. Ali Ourdjini
Also available in CD ROM : CP 055087 ra
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000006898 | XX(793035.1) | Closed Access Thesis | UTM Project Paper (Open Shelves) | Searching... |
Searching... | 30000010294445 | TN490.B6 C46 2012 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
