Skip to:Content
|
Bottom
Cover image for Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish
Title:
Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1 CD-ROM; 12cm.
General Note:
Also available in prinnted version : TS690 Y42 2005 raf
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
FKM30000004577 CP 10748 UTM Special Collection - Computer File Compact Disk (Open Shelves)
Searching...
Searching...
30000010092162 CP 10748 UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
Searching...

On Order

Go to:Top of Page