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Cover image for Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
Title:
Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
Personal Author:
Publication Information:
2012
Physical Description:
xxiii, 217 p. : ill. (some col.) ; 30 cm.
General Note:
Also available in CD-ROM : CP 028013 ra

Supervisors : Prof. Dr. Ali Ourdjini, Assoc. Prof. Dr. Astuty Amrin
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Doktor Falsafah (Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2012

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32000000001168 TJ243 S25 2012 raf Closed Access Thesis UTM PhD Thesis (Closed Access)
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30000010292465 TJ243 S25 2012 raf Closed Access Thesis UTM PhD Thesis (Closed Access)
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SPS30000003303 TJ243 S25 2012 raf Closed Access Thesis UTM PhD Thesis (Closed Access)
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