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Cover image for Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
Title:
Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
Personal Author:
Publication Information:
2012
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TJ243 S25 2012 raf

Supervisors : Prof. Dr. Ali Ourdjini, Assoc. Prof. Dr. Astuty Amrin
DSP_DISSERTATION:
Thesis (Doktor Falsafah (Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2012

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30000010292466 CP 028013 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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