Title:
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Personal Author:
Series:
Research Monograph (Universiti Teknologi Malaysia. Research Management Centre)
Physical Description:
xiv, 174 pages : illustrations ; 29 cm.
ISBN:
9789673537877
Subject Term:
Added Corporate Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010319530 | TK7870.15 A456 2011 af | Non Circulating UTM Special Collection Materials | Research Report (Closed Access) | Searching... |