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Cover image for Classical and damage mechanics-based models for lead-free solder interconnects
Title:
Classical and damage mechanics-based models for lead-free solder interconnects
Personal Author:
Publication Information:
2009
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TK7870.15 L344 2009 raf

Supervisors : Prof. Dr Mohd. Nasir Tamin and Dr Nazri Kamsah
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009

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30000010223484 CP 017372 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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