Title:
Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish
Personal Author:
Publication Information:
2009
Physical Description:
xviii, 120 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 023216 ra
Supervisor : Assoc. Prof. Dr. Ali Ourdjini
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal-Bahan)) - Universiti Teknologi Malaysia, 2009
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000006361 | TS610 C48 2009 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010213253 | TS610 C48 2009 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
