Skip to:Content
|
Bottom
Cover image for Microwave de-embedding : from theory to applications
Title:
Microwave de-embedding : from theory to applications
Publication Information:
Amsterdam ; Boston : Elsevier/AP, Academic Press is an imprint of Elsevier, [2014]
Physical Description:
xxiv, 456 pages : illustrations ; 25 cm.
ISBN:
9780124017009
Subject Term:

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
30000010337261 TK7876 M5257 2014 Open Access Book Book
Searching...

On Order

Summary

Summary

This groundbreaking book is the first to give an introduction to microwave de-embedding, showing how it is the cornerstone for waveform engineering. The authors of each chapter clearly explain the theoretical concepts, providing a foundation that supports linear and non-linear measurements, modelling and circuit design. Recent developments and future trends in the field are covered throughout, including successful strategies for low-noise and power amplifier design. This book is a must-have for those wishing to understand the full potential of the microwave de-embedding concept to achieve successful results in the areas of measurements, modelling, and design at high frequencies.

With this book you will learn:

The theoretical background of high-frequency de-embedding for measurements, modelling, and design Details on applying the de-embedding concept to the transistor's linear, non-linear, and noise behaviour The impact of de-embedding on low-noise and power amplifier design The recent advances and future trends in the field of high-frequency de-embedding


Author Notes

Giovanni Crupi is an assistant professor at the University of Messina, Italy, where he teaches microwave electronics and optoelectronics. Since 2005, he has been a visiting scientist with KU Leuven and IMEC, Leuven, Belgium. Giovanni's main research interests include small and large signal modeling of advanced microwave devices. He is the chair of the IEEE Microwave Theory and Techniques Society (MTT-S) Fellowship program and serves as an associate editor of International Journal of Numerical Modeling: Electronic Networks, Devices and Fields.
Dominique M.M.-P. Schreurs is a full professor at KU Leuven, Leuven, Belgium. Previously, she has been a visiting scientist at Agilent Technologies (USA), Eidgenssische Technische Hochschule Zrich (Switzerland), and the National Institute of Standards and Technology (USA). Dominique's main research interests concern linear and nonlinear characterization and modeling of microwave devices and circuits, as well as linear and nonlinear hybrid and integrated circuit design for telecommunications and biomedical applications. She is the technical chair of ARFTG and serves as the editor of the IEEE Transactions on Microwave Theory and Techniques.


Table of Contents

Giovanni GhioneStephen MaasGiovanni Crupi and Dominique M.M.-P. Schreurs and Alina CaddemiGilles DambrineErnesto Limiti and Walter Ciccognani and Sergio ColangeliJames C. RautioIltcho Angelov and Gustavo Avolio and Dominique M.M.-P. SchreursWendy Van Moer and Lieve Lauwers and Kurt BarbéJosé C. Pedro and Telmo R. CunhaManuel Yarlequé and Dominique M.M.-P. Schreurs and Bart Nauwelaers and Davide Resca and Giorgio VanniniAntonio Raffo and Valeria Vadalà and Giorgio Vannini
Forewordp. xi
Forewordp. xiii
About the Editorsp. xv
Authors' Biographiesp. xvii
Authorsp. xxiii
Chapter 1 A Clear-Cut Introduction to the De-embedding Concept: Less is Morep. 1
1.1 Introductionp. 1
1.2 Microwave measurementsp. 2
1.2.1 Linear measurements: from scattering to noise parametersp. 5
1.2.2 Nonlinear measurementsp. 9
1.3 Microwave modelingp. 10
1.3.1 Small-signal equivalent circuitp. 12
1.3.2 Large-signal equivalent circuitp. 22
1.4 From de-embedding to waveform engineeringp. 25
1.4.1 De-embedding: from scattering to noise parametersp. 26
1.4.2 De-embedding: nonlinear time-domain waveformsp. 28
1.5 De-embedding: experimental resultsp. 30
1.5.1 Basics of FinFETp. 30
1.5.2 From scattering to noise parametersp. 32
1.5.3 Nonlinear time-domain waveformsp. 36
Referencesp. 39
Chapter 2 Millimeter-Wave Characterization of Silicon Devices under Small-Signal Regime: Instruments and Measurement Methodologiesp. 47
2.1 Preliminary conceptsp. 47
2.1.1 Advanced silicon technologies and mm-wave applicationsp. 47
2.1.2 S-parameter measurements: basicsp. 48
2.1.3 High-frequency noise measurements: basicsp. 55
2.2 On-wafer mm-wave instruments and setupp. 61
2.2.1 On-wafer station and setupp. 62
2.2.2 Millimeter-wave vectorial network analyzer: principle and architecturep. 63
2.2.3 Millimeter-wave noise receivers: principle and architecturep. 64
2.3 Calibration and de-embedding procedures for on-wafer measurementsp. 66
2.3.1 Off-wafer calibration procedures: principle and calibration kitp. 69
2.3.2 On-wafer de-embedding procedures: principle and de-embedding test structuresp. 74
2.4 Applications: advanced silicon MOSFETs and HBTsp. 83
2.4.1 Small-signal modeling and validation in mm-wave frequency rangep. 83
2.4.2 Noise parameter extraction techniques and validation in the mm-wave frequency rangep. 84
Referencesp. 92
Chapter 3 Characterization and Modeling of High-Frequency Active Devices Oriented to High-Sensitivity Subsystems Designp. 97
3.1 Introductionp. 97
3.2 High-frequency noise measurement benchesp. 99
3.2.1 Typical instrumentationp. 99
3.2.2 Measuring noise powerp. 102
3.2.3 Typical test bench architecturesp. 104
3.3 From noise power to noise parameters computation and modelingp. 106
3.3.1 Noise factor computationp. 106
3.3.2 Full noise characterization and modelingp. 112
3.4 Measurement errorsp. 126
3.4.1 Noise factor uncertaintyp. 126
3.4.2 Effects of receiver compressionp. 129
3.4.3 Considerations on receiver bandwidthp. 130
3.5 High-sensitivity subsystems designp. 133
3.5.1 Traditional approachesp. 133
3.5.2 A systematic approach utilizing constant-mismatch circles, degenerative feedbackp. 134
3.5.3 Noise measure-based design for multistage amplifiersp. 140
3.5.4 Postproduction designp. 143
Referencesp. 146
Chapter 4 High-Frequency and Microwave Electromagnetic Analysis Calibration and De-embeddingp. 151
4.1 Introductionp. 151
4.2 Double-delay calibrationp. 152
4.2.1 Overview of double-delayp. 152
4.2.2 Theory of double-delayp. 153
4.2.3 Failure mechanisms of double-delayp. 158
4.2.4 Exact evaluation of EM analysis and calibration errorp. 161
4.3 Multiple coupled port calibration and de-embeddingp. 164
4.4 Short-open calibrationp. 167
4.4.1 SOC theoryp. 169
4.4.2 Relationship between SOC and double-delayp. 171
4.5 Local ground and internal port de-embeddingp. 173
4.5.1 Theory of local ground and internal port de-embeddingp. 175
4.5.2 Failure mechanisms of local ground and internal port de-embeddingp. 181
4.6 Circuit subdivision and port tuning: application of calibrated portsp. 182
Referencesp. 187
Chapter 5 Large-Signal Time-Domain Waveform-Based Transistor Modelingp. 189
5.1 Introductionp. 189
5.2 Large-signal transistor modeling: overviewp. 190
5.3 Modeling currents (I-V) and charges (Q-V): procedurep. 193
5.3.1 Model equationsp. 193
5.3.2 Extraction of basic parametersp. 197
5.3.3 Modeling functionsp. 204
5.3.4 Capacitances model and implementation in simulatorsp. 206
5.4 Time-domain waveform-based models extractionp. 214
5.4.1 Modeling of currents and charges from high-frequency time-domain waveformsp. 214
5.4.2 Low-frequency waveforms-based modeling of currentsp. 214
5.4.3 Combining low- and high-frequency time-domain waveformsp. 216
Referencesp. 220
Chapter 6 Measuring and Characterizing Nonlinear Radio-Frequency Systemsp. 225
6.1 Introductionp. 225
6.2 Measuring the nonlinear behavior of an RF systemp. 226
6.2.1 Sampling and calibration issuesp. 226
6.2.2 Sampler-based measurement instrumentsp. 227
6.2.3 Mixer-based measurement instrumentsp. 228
6.2.4 Calibration procedure for nonlinear measurement instrumentsp. 230
6.2.5 On-wafer calibrationp. 231
6.2.6 Advantages and disadvantagesp. 232
6.3 Best linear approximation and nonlinear in-band distortionsp. 233
6.3.1 Approximate modelingp. 233
6.3.2 Best linear approximation: the conceptp. 233
6.3.3 Excitation signalsp. 235
6.3.4 Estimating the best linear approximationp. 236
6.3.5 Measurement examplep. 237
6.4 Out-of-band best linear approximationp. 238
6.4.1 Out-of-band best linear approximation: the conceptp. 238
6.4.2 Determining the out-of-band best linear approximationp. 239
6.4.3 Measurement examplep. 240
6.5 Compensating nonlinear out-of-band distortionsp. 245
6.5.1 Adjacent co-channel power ratiop. 245
6.5.2 Compensating source-pullp. 246
Referencesp. 253
Chapter 7 Behavioral Models for Microwave Circuit Designp. 255
7.1 Introductionp. 255
7.2 Behavioral modeling toolsp. 256
7.2.1 Physics-based and behavior-based modelsp. 256
7.2.2 Behavioral modeling technologyp. 267
7.2.3 Behavioral models for RF and microwave devicesp. 279
7.2.4 De-embedding measurement datap. 286
7.3 Embedding and de-embedding behavioral modelsp. 294
7.3.1 Behavioral modeling embedding and de-embeddingp. 295
7.3.2 Considerations on model inversionp. 298
7.3.3 Examples of behavioral modeling embedding and de-embeddingp. 301
Referencesp. 312
Chapter 8 Electromagnetic-Analysis-Based Transistor De-embedding and Related Radio-Frequency Amplifier Designp. 317
8.1 Introductionp. 317
8.2 Electromagnetic analysis of MMIC transistor layoutp. 317
8.2.1 Dielectric stack and metal layers definitionp. 319
8.2.2 Mesh cell dimensioning and functional partitioningp. 320
8.2.3 Port definitionsp. 321
8.2.4 Setup for complex layout modelp. 322
8.2.5 Full-wave EM simulation of a transistor passive structurep. 323
8.2.6 Frequency range of analysisp. 324
8.2.7 EM simulator outputp. 324
8.3 Transistor modeling based on a distributed parasitic network descriptionp. 325
8.3.1 Distributed modeling approachesp. 325
8.3.2 Model definition and identificationp. 326
8.3.3 Model scalability and frequency extrapolation capabilitiesp. 329
8.3.4 Experimental and simulation resultsp. 331
8.3.5 Complexity issues and nonlinear modelingp. 333
8.4 Full-wave EM analysis for transistor equivalent circuit parasitic element extractionp. 338
8.4.1 Model definition and identificationp. 339
8.4.2 Model scalability and frequency extrapolation capabilitiesp. 344
8.4.3 Experimental and simulation resultsp. 344
8.5 Examples of application to MMIC designp. 346
8.5.1 A more flexible use of transistor layoutp. 346
8.5.2 MMIC design based on distributed transistor modelsp. 348
8.6 De-embedding for bare-die transistorp. 353
8.6.1 Case study: bare-die transistor in test fixturep. 354
8.6.2 Equivalent circuit model for extrinsic networksp. 355
8.6.3 Four-port representation of extrinsic networkp. 362
8.6.4 De-embedding of transistor S parametersp. 368
8.7 Bare-die transistor modeling and power amplifier designp. 370
8.7.1 Transistor modelingp. 371
8.7.2 Class-AB and class-E power amplifier designp. 373
Referencesp. 379
Chapter 9 Nonlinear Embedding and De-embedding: Theory and Applicationsp. 385
9.1 Introductionp. 385
9.2 Waveform engineering at the current-generator planep. 386
9.2.1 Modeling hintsp. 386
9.2.2 Measurement hintsp. 391
9.3 Nonlinear embedding design techniquep. 396
9.3.1 Theoretical formulationp. 396
9.3.2 Design examplesp. 400
9.4 Nonlinear de-embedding design techniquep. 415
9.4.1 Theoretical formulationp. 428
9.4.2 Experimental examplesp. 429
9.5 Nonlinear embedding versus de-embedding: a comparative analysisp. 435
Referencesp. 439
Indexp. 445
Go to:Top of Page