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25. 
Cover image for Asia and China in the global economy
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Cover image for A lean manufacturing implementation framework for the Malaysian electrical and electronics industry
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Cover image for A lean manufacturing implementation framework for the Malaysian electrical and electronics industry
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Cover image for Forensic investigation on composite laboratory, Faculty of Mechanical Engineering, Universiti Teknologi Malaysia
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Cover image for Forensic investigation on composite laboratory, Faculty of Mechanical Engineering, Universiti Teknologi Malaysia
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Cover image for System-on-chip (SoC) testing using adhoc high-level design for-testability method
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Cover image for System-on-chip (SoC) testing using adhoc high-level design for-testability method
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Cover image for Malaysia's international trade issues : an impressionistic view
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Cover image for Special topics in bioprocess engineering
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Cover image for Performance evaluation of diamond adhesion strength on WC flat grinding wheels
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