Title:
Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish
Personal Author:
Publication Information:
2007
Physical Description:
xvii, 112p. : ill. ; 30 cm. + 1 CD-ROM
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini
Also available in CD-ROM : CP 020346 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000001859 | TN690 L54 2007 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010180375 | TN690 L54 2007 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
