Title:
Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish
Personal Author:
Publication Information:
2006
Physical Description:
xvi, 140 p. : ill. (some col.) ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini
Also available in CD-ROM : CP 013607 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006
Available:*
Library | Item Barcode | [[missing key: search.ChildField.CALLNUMBER]] | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000001764 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... | |
Searching... | 30000010141039 | TS610 S58 2006 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
