Title:
Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product
Personal Author:
Publication Information:
2007
Physical Description:
xx, 102p. : ill. ; 30cm. + 1 CD-ROM
General Note:
Supervisor : Dr. Nazri Kamsah
Also available in CD-ROM : CP 020309 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000003545 | TK7868.P7 C44 2007 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010143195 | TK7868.P7 C44 2007 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
