Title:
Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
Personal Author:
General Note:
Journal of Phase Equilibria, Vol. 20(3) : 199-206. 1999
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
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Searching... | 30000010238142 | MAK 17717 | Open Access Book | ILL Article | Searching... |